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Summary:
Provide Embedded Package design total solution; include but not limited to Stack up discussion . ECP module design, layout, development, timeline tracking and handle the module relevant qualification.
RESPONSIBILITIES:

1. Embedded substrate or PCB layout for Module projects.
2. Need work with Substrate/PCB vendor, assembly house, SMT site, material vendor, to develop and qualify the new materials and new package processes.
3. Coordinate with the internal team to identify the module package related issues, giving report/suggestions for new packages, address the root cause and find the solution.
4. Sum up the experience of Embedded package design, SMT and maintain the design rule.
5. Review the packaging drawings and assure them to meet package design rules, including package outline, build kit, lead frame drawing, bump mask drawing, etc;
6. Tracking new module PKG timeline and response to internal team.
7. Perform other tasks assigned by superiors.

REQUIREMENTS:
1. Hands-on experience on substrate design in Substrate/PCB factory.
2. Be Proficient Cadence software. AutoCAD.
3. Good knowledge of Embedded packages design rules and manufacture processes/ issues
4. Bachelor’s degree with 5 years related experience.
KEY WORDS:
Embedded Substrate layout, OrCAD
Package designer Standard, CAD, substrate manufacture experience