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Summary: 1. The candidate will drive innovation and performance improvement in key materials such as epoxy, molding compounds, and underfill materials. 2. A main responsibility will be to develop and qualify 2nd source suppliers domestically, ensuring a resilient, cost-effective, and high-quality supply chain for advanced semiconductor packaging. RESPONSIBILITIES: 1. Lead the research and development of next-generation packaging materials, including but not limited to: Epoxy die-attach adhesives, Molding compounds for fan-out, SiP, and other advanced packages, underfill materials. 2. Define material specifications, performance targets (thermal, mechanical, electrical, reliability), and qualification plans. 3. Conduct deep-dive technical analysis on material properties, failure mechanisms, and process compatibility. 4. Collaborate with material suppliers, internal process engineering, and reliability teams to optimize material formulation and performance. 5. Identify, evaluate, and onboard qualified domestic materials suppliers as 2nd sources. 6. Lead the technical assessment, including material characterization, comparative testing, and process window evaluation against baseline materials. 7. Manage the full qualification cycle for new suppliers/materials, from initial samples to production release, ensuring they meet all quality, reliability, and cost requirements. REQUIREMENTS: 1. Deep expertise in chemistry, formulation, processing, and failure modes of key packaging polymers. 2. Strong experience in material characterization techniques (TGA, DMA, rheology, etc.) and reliability testing (MSL, TCT, HAST, etc.). 3. Master’s or PhD degree in Materials Science, Chemical Engineering, Polymer Science, Chemistry, or a closely related field. 4. Master’s or PhD degree with 5 years related experience.